Target material is one of the main materials for preparing thin films. It is mainly used in integrated circuits, flat panel displays, solar cells, recording media, smart glass, etc., and requires high material purity and stability. The working principle of the sputtering target: Sputtering is one of the main techniques for preparing thin film materials. It uses the ions generated by the ion source to accelerate and accumulate in a vacuum to form a high-speed energy ion beam current that bombards the solid surface. It exchanges kinetic energy with the atoms on the solid surface, causing the atoms on the solid surface to leave the solid and deposit on the surface of the substrate. The bombarded solid is the sputtering target. The development trend of target materials is: high sputtering rate, crystal grain orientation control, large size, high purity metal. The target material is welded by "target blank" and "back plate".
(1) The target blank is the target material bombarded by the high-speed ion beam, which belongs to the core part of the sputtering target material, involving high-purity metal and crystal grain orientation control. In the sputtering coating process, after the target blank is hit by ions, its surface atoms are scattered by sputtering and deposited on the substrate to form an electronic thin film.
(2) The back plate plays a major role in fixing the sputtering target material and involves the welding process. Due to the low strength of high-purity metal, the sputtering target needs to be installed in a dedicated machine to complete the sputtering process. The interior of the machine is in a high-voltage and high-vacuum environment. Therefore, the pure metal sputtering target blank needs to be joined with the back plate through different welding processes, and the back plate needs to have good electrical and thermal conductivity.
